院报 ›› 2020, Vol. 37 ›› Issue (2): 170-173.DOI: 10.11988/ckyyb.20181192

• 仪器设备与测试技术 • 上一篇    下一篇

三维激光扫描和红外检测融合技术的工程应用

孙保燕, 陈文   

  1. 桂林电子科技大学 建筑与交通工程学院,广西 桂林 541004
  • 收稿日期:2018-11-07 出版日期:2020-02-01 发布日期:2020-04-09
  • 通讯作者: 陈 文(1990-),男,广西河池人,硕士研究生,研究方向为工程信息化技术。E-mail:0225chenwen@sina.com
  • 作者简介:孙保燕(1962-),男,广西桂林人,教授,硕士生导师,研究方向为图像处理与逆向工程。E-mail:385872445@qq.com
  • 基金资助:
    广西自治区科学研究与技术开发计划项目(桂科攻1598019-8);桂林电子科技大学 创新计划项目(2017YJCX122)

Engineering Applications of Fusion of 3D Laser Scanning and Infrared Detection Technology

SUN Bao-yan, CHEN Wen   

  1. College of Architecture and Traffic Engineering, Guilin University of Electronic Technology, Guilin 541004, China
  • Received:2018-11-07 Online:2020-02-01 Published:2020-04-09

摘要: 为了解决传统红外热成像仪探测建筑物墙面的热工缺陷时得到的二维图像信息存在缺少目标位置信息、数据杂乱无序的问题,提出一种将图像信息和点云模型融合的方法。该方法通过红外图像处理、直方图面积计算、提取边缘轮廓和模型融合,得到具有目标探测信息的三维建筑模型,并利用标识点分析了模型的拼接误差。研究和实践结果表明:此方法具有可行性,拼接模型精度高;采用融合的三维建筑模型可以直观地获取热工缺陷的位置坐标和面积大小,便于指导修复工作。研究成果对于信息集成化管理、智慧建筑检测等具有一定的指导意义和应用价值。

关键词: 三维激光扫描, 红外检测, 图像处理, 拼接误差, 建筑模型

Abstract: The 2D image obtained by traditional infrared thermal imager lacks target position and the data is chaotic in the detection of thermal defects of building wall. In view of this, a method by fusion of image information and point-cloud model is presented in this paper. This method obtains a 3D building model with target information through infrared image processing, histogram area calculating, edge contour extracting and model fusing. The mosaic error of the obtained model is also analyzed using the identification points. Research and experimental results demonstrate the feasibility of the present method and the high precision of the splicing model. The position coordination and area of thermal defects can be acquired directly by the integrated 3D building model to guide the repair work. The research finding is of guiding significance and application value for integrated information management and intelligent building detection.

Key words: 3D laser scanning, infrared detection, image processing, splicing error, architectural model

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